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  20/04/2017 | Trade Fair

interpack: Bosch presents dual-lane packaging system

Bosch will be presenting a dual-lane version of its two-in-one biscuit packing system at interpack 2017 in Dusseldorf/Germany. The single-lane system was premiered at interpack 2014 and is already used by customers worldwide. The new high-performance system goes even further in terms of flexibility and speed: it is the first system to produce single, pile and slug packs on two independently operating lanes.

Ground-breaking technology teams with robust design and harmonized processes to ensure a high level of overall equipment effectiveness. “Our compact system stands for maximum efficiency and productivity, from product distribution to the closed carton”, says Daniel Bossel, product manager at Bosch Packaging Technology.

interpack, hall 6, booth C 58